Leadis Technology Ships OLED Panel Driver ICSamsung SDI Filed Numerous OLED Patent Applications Samsung Develops RFID RefrigeratorSamsung Develops Tiny 3-million Pixel CMOS SensorMotis Suspends Supplying Mobile Molding Components to LG ElectronicsHitachi Displays Starts Volume Production of 800 x 480 Pixel Cell Phone DisplaySeiko Epson Develops Tiny GPS ModuleFuji Film’s Shipment of Camera Components for Cellular Phones Growing
STMicroelectronics Markets 70nm Generation NAND FlashHynix Semiconductor Develops 200MHz 512Mbit DRAM for Mobile ApplicationsSamsung Electronics to Supply PRAM to NokiaPanasonic Develops Thin Micro SpeakerSharp Commercializes 5M Pixel CCD Camera Module for Cellular PhonesSanyo Electric Divests LCD OperationNew Type of SiP to Gain PopularityTaiwan Mobile Announces GSM/Wi-Fi Smartphone
Renesas Cuts Back NOR Flash OperationToshiba Introduces Portable Audio Player with Terrestrial Broadcasting TunerLGE and SE to Be First to Adopt 65nm Flash in Cellular PhonesCellular Phones with Built-in RFID Chip to Appear in S. Korea during 2H 2007Samsung Electronics Ships High-end Dual Mode Handset in ChinaC&S Develops VoIP Chip for IP PhonesLenovo to Launch $100 PCTexas Instruments Develops SoC for Low Cost Phones
Fujitsu Component Develops Tiny UWB AntennaSharp Showcases 0.89 mm Thick Cellular Phone PanelEpson to Launch Digital Video EncoderDoCoMo Launches WCDMA Phone with Safety LockLG Electronics Ties up with Lens ManufacturerHynix Posts Record High Revenue for 3Q 2006BenQ to Roll out 3.5G Cellular Phone in November 2006Lenovo's Handsets to Use Spansion's Flash Memory
Siliconfile Develops 5M Pixel CMOS Image SensorMCNEX Develops Camera Module with Built-in AntennaLG Innotek Develops High Luminosity 2.2-inch QVGA LCDOlympus Announces Improved Water Proof Digital Camera Sharp Develops Triple View LCDKyocera Develops Thin Wireless LAN ModuleCMEL and CMO Develop 25-inch OEL Panel for TVs
Mtekvision to Mass Produce MMP for DRM Music PhoneCowon to Market Tiny Audio PlayerSamsung Electro-Mechanics Mass Produces Flip Chip CSP SubstratesSamsung Electronics Hit Hard by Falling Semiconductor PricesSamsung Electronics to Produce 3.2M Pixel CISSeiko Precision Develops Camera Module with AF SupportTDK Develops Compact Memory DiskSeiko Epson Develops World's Thinnest Electronic PaperNAND Flash Memory Price Decline Accelerates