Portelligent TechAlert Service:
Component Technology - Third Quarter 2003

Prior TechAlert Service Articles: 2001 - 2007 Archive

September 17, 2003

Japanese Firms Rush to Roll out Mega Pixel Imagers for Camera Handsets
Mitsubishi Electric Improves Cellular Phone Camera Manufacturing Process
Battery Strategy of Sanyo Electric and Japan Storage Battery
Seiko Precision Develops Thin Shutter for Camera Cellular Phones
Sharp Develops Fast Access Flash Memory
Ube Industries to Supply Film Substrate
NEC Electronics to Increase Outsourcing of Semiconductor Assembly and Testing
Sony Develops Bi-CMOS Semiconductor Manufacturing Technology

September 5, 2003

Rohm Introduces One Chip Image Processing Engine for Cellular Phones
Qualcomm's Baseband Chipsets Support Mini SD and SD card
Toshiba to Raise NAND Flash Memory Output Ahead of Schedule
Toshiba Develops Smallest Logic IC
Sharp to Commercialize Smallest Mega-pixel CCD Module
Lexar Announces 4GB CompactFlash, Hitachi Samples 4GB Microdrive
Mitsubishi Materials Noise Removal Filter for Cellular Phones
Hitachi Maxell to Strengthen Li-ion Battery Operation

August 13, 2003

Samsung SDI to Mass Produce FS Method LCD
Konica to Commercialize Plastic Lens Component
Global Flash Memory Card Shipments to Exceed 100 Million Units in 2003
Culture Com Announced CPU Optimized for Chinese Language
NEC Electronics to Supply Sound Source Chip to Cellular Phones
Verizon and Vodafone to Co-develop Data Communication Card for U.S. and Europe
Renesas Develops Four Chip Stack MCP for Cellular Phones
Samsung to Start Manufacturing Memory Stick

July 23, 2003

SEL and Partners Co-develop Active Matrix OEL
NEC Subsidiary Develops Super Small Speaker System on LCD
Tohoku Pioneer to Supply OEL Sub-Displays
Matsushita Electronic Components Develops Small Receiver for Cellular Phones
Samsung Electronics Develops Next Generation Memory Technology
Matsushita Electric to Commercialize System LSI with Embedded FeRAM
Toshiba to Introduce 1M pixel CMOS Sensor
North to License Multilayer Flexible PCB Technology

July 21, 2003

J-Phone to Introduce Mega Pixel 3G Wireless Handset
NEC to Supply 3G Wireless Infrastructure to Hutchison 3G
Casio and LG TeleCom Tie up to Supply Camera Handsets to South Korea
NEC Prototypes 3G Wireless Handset with Digital TV Viewing
NEC to Reenter U.S. Cellular Phone Market
Nokia Introduces Tri-band GSM Handsets in Japan
Sony Ericsson Losses Continue
Palm OS Smart Phone to Debut in China
Japanese Handset Shipments to Rise in FY2003