Chipography® Reports come in three varieties.
Level 1 Reports identify primary ICs, provide die-size parameters, and include selected die photos and information on major sub-assemblies such as camera and display module.
Level 2 Reports include the Level 1 data elements, but also include price estimates for the ICs and total overall component counts.
Level 3 Reports include the Level 2 data elements, but also include a full bill-of-materials for electronic components.
For further details on the content elements of Chipography® Reports, Portelligent customers may download the presentation "Portelligent Chipography® Reports Channel Overview"