Portelligent

Home | About Us | Contact

User Name

Password

New Full Product Teardown Reports

Nintendo DSi Handheld Gaming Console: Nintendo’s third generation of the “DS” handheld digital video game system, the Nintendo DSi, was released to the North American electronic consumer market April 5, 2009. The DSi was unveiled with much fanfare in the 4th quarter of 2008 at the Nintendo Conference in Tokyo, Japan. Physically the unit is slightly smaller than the earlier DS Lite but the biggest addition comes in the form of 0.3MP (VGA) internal and external cameras. The DSi’s displays are bigger than the preceding models, now 3.25-inches versus 3.0-inch found in the earlier products. Only the bottom display is a touch screen. The DSi is WiFi enable and has a SD Memory Slot. Users can still PictoChat, shop online, download games and applications, download and play back music, and make slide show of photos, along with a range of other software features.

Samsung SPH-W7900 UMTS Pico Projector Phone: The Samsung SPH-W7900 is a high-tier 5MP camera phone with a built-in DLP pico projector. It supports tri-band GSM and single-band W-CDMA with HSDPA data. The SPH-W7900 features a 3.2-inch AMOLED display (262K colors) with a touchscreen overlay for primary navigation. Supplementing the 5MP camera is a VGA camera mostly for conference calls. The SPH-W7900 supports Bluetooth as well as T-DMB television. An external microSD memory card slot provides additional memory for storage and easy removal of photos.

New Chipography® Reports

Apple iPhone 3G S UMTS Smartphone

Casio W63CA CDMA-EVDO 8MP Camera Phone w/ 1-Seg TV

Palm Pre Dual-Band CDMA/EvDO Smartphone

Samsung SCH-r211 Tri-Band CDMA Phone

Each Product Teardown Report contains:
*	Executive summary
*	Block diagram
*	Detailed, high-resolution, color photos, external & internal hardware
*	Detailed step-by-step disassembly reverse-engineering process
*	Power measurements
*	Circuit board & packaging metrics
*	Complete electrical and mechanical BOM (Bill of Materials)
*	Die photos
*	PCB cross sections
*	System complexity and design benchmarking metrics
*	Manufacturing cost analyses
*	Description of most interesting electronic features and packaging concepts

following are headlines from current notes:

Competitive Alert - June 25, 2009
Tower Semiconductor to Produce Crocus’s MRAM * AUO and Changhong Electric to Establish LCD Module Joint Venture * China Mobile in Talks with Reliance Communications * India Bans Chinese Phones Without IMEI Numbers * Kairen Introduces Keychain-Style Digital Photo Frame * One Seg-Compatible Prepaid Phone from SoftBank * Shinsei Develops Palm-Size WiMAX Router * Japanese Publishers to Distribute Manga to iPhones

Component Technology - June 29, 2009
Idemitsu to Team Up with LG Display in OEL Operation * Pioneer and Sharp to Form Optical Disc Joint Venture * Exemode Launches Inexpensive, Waterproof DSC with Video Support * KDDI’s Android Phone to Go on Sale in 2010 * DoCoMo’s Snapdragon Handset Encounters Software Problem * Renesas Develops Image-Improvement Technology * Spansion Japan to Lay Off 60% of Its Workforce * Dongbu HiTek and SETi to Begin Production of 2MP CMOS Sensors

Wireless Technologies - July 2, 2009
Sony Preps PSP Cell Phone * Fujitsu Solicits Cell-Phone Designs from the Public * Softbank Mobile Cans Cell-Phone Virtual Reality Service * Stylife to Sell Apparel via KDDI’s Cell Phones * Huawei Japan Establishes LTE Lab in Tokyo * China Telecom in Talks with RIM * EVN Telecom to Install 5000 3G Base Stations in Vietnam * Best Buy Calls for Greater Cell-Phone Sales

Know Your Competition ... Know Your Options ... Know Your Opportunities